New Ultra-High Speed 3.2 GSPS 12-bit ADC XMC Module - Spectrum
Spectrum Announces New Ultra-High Speed 3.2 GSPS 12-bit ADC and FPGA Processing XMC Module - The XMC-1151 provides ultra-high speed analog-to-digital conversion (ADC) at 12-bit 3.2 GSPS combined with high-density FPGA processing in a rugged, space-efficient XMC (VITA 42.3) module.
SIGINT.
“Spectrum is excited to offer customers one of the industry’s fastest available 12-bit ADCs combined with high-density FPGA processing,” said Douglas Fast, President of Spectrum. “The XMC-1151 satisfies our customers' need for an ultra-high bandwidth I/O and processing solution that is compact and modular enough to be deployed in a variety of applications in both benign and harsh environments.”
The XMC-1151 uses the latest 12-bit National Semiconductor ADC12D1600 device, which supports sampling rates of up to 1.6 GSPS when operated in dual-channel mode, or 3.2 GSPS in single-channel interleaved mode. The ADC is tightly coupled with a large Xilinx Virtex-6 LX240T FPGA for high-bandwidth signal processing functions such as channelization, filtering, and demodulation.
Other notable features of the XMC-1151 include:
* Up to 1 GB DDR3 SDRAM
* XMC (VITA 42.3) form factor
* PCI Express x8 Gen 2 supporting up to 4 GB/sec to host carrier
* Rugged, conduction-cooled or air-cooled format
* Multi-board synchronization for phase-coherent sampling applications such as beam forming, direction finding, emitter location and SIGINT
* General purpose digital I/O including user-configurable high-speed serial links
* For a full listing of features and specifications, visit the XMC-1151 product page.
The XMC-1151 is compatible with third party single-board computers (SBC) and host carriers that support XMC (VITA 42.3) modules. Spectrum’s quicComm™ software suite enables users to rapidly integrate systems with other Spectrum modules, carrier boards and SBCs. The XMC-1151 is also available with different FPGA options (LX130T to SX475T), and ruggedization levels including extended temperature and conduction cooling. A 3U OpenVPX™ (VITA 65) version of this module is also planned.
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